Drilling of vias in silicon and glass

Sub-micron via drilling with high aspect ratios for TSV and TGV applications

Damage-free ablation in silicon and glass using ultrashort pulses

Compatible with evolving 3D integration and packaging trends

Wafer dicing

High-speed, precision dicing of thin and brittle wafers

Reduced chipping and debris vs. mechanical sawing

Supports advanced materials: SiC, GaN, sapphire

Perovskite scribing

P1–P3 scribing with sub-micron accuracy

Minimizes thermal stress on sensitive perovskite layers

Supports tandem and flexible module manufacturing

Thin film removal

Selective layer ablation on CIGS, CdTe, and TCO materials

Controlled depth penetration with minimal substrate impact

In-line process compatible with roll-to-roll and sheet-fed lines

Edge isolation, xBC / IBC cell structuring

Electrical isolation to prevent shunting and leakage

Structuring for high-efficiency back-contact solar cells

Enables interdigitated contact patterning with micron accuracy

Anode/cathode structuring

Microchannel drilling improves lithium-ion diffusion

Uniform feature profiles enhance battery performance

Compatible with graphite, silicon, and solid-state materials

Separator foil cutting

Burr-free, debris-free cutting of polymer/ceramic separators

Maintains edge stability at high throughput

Applicable to PE, PP, PET-based multilayer films

Notching and coating removal

Precise electrode notching for pouch and cylindrical cells

Selective removal of active layers without damaging current collector

Supports advanced battery designs and chemistries

PCB micro via drilling

High-density interconnect (HDI) via drilling below 50 µm

Clean hole profiles for multilayer boards

UV/Green wavelengths enable polymer and copper selectivity

Glass and ceramic PCB machining

Crack-free cutting and drilling of alumina, AlN, and borosilicate substrates

Maintains electrical insulation integrity

Ideal for high-frequency and RF applications

Surface texturing

Functional texturing for thermal management or wettability

Sub-micron precision across metals and ceramics

Non-contact process reduces mechanical wear

Ultra-thin glass cutting

Clean, precise separation down to <100 μm thickness

Avoids microcracks through cold ablation

High-speed scribing for foldable and flexible displays

Transparent material drilling

Laser-induced breakdown for glass and sapphire drilling

High aspect ratio microholes with minimal taper

Suitable for cover glass and optical components

Optical lens micro-structuring

Micron-scale surface modification for functional optics

Enables lenslet array and diffractive structure creation

High repeatability across curved or complex surfaces

Stent micro-drilling

Fine hole drilling in Nitinol, stainless steel, and CoCr alloys

Eliminates recast layer and HAZ for biocompatibility

Scalable to neurovascular and cardiovascular stents

Catheter and microfluidic cutting

Non-contact micromachining of polymers and silicones

Enables sharp features in tubing and channel networks

Maintains clean internal diameters and structural integrity

Surgical tool processing

Precision edge shaping for scalpels, bone saws, micro-scissors

Enhances sharpness and durability

Corrosion-free finishes for stainless steel and titanium